Lub ntsiab zoo ntawm N-hom roj teeb dhau
Tsawg attenuation: P-hom roj teeb siv boron-doped silicon wafer substrates, uas yooj yim tsim boron-oxygen khub tom qab pib lub teeb pom kev zoo, ntxiab electrons hauv silicon wafer substrates los tsim cov chaw recombination, ua rau lub zog attenuation, txawm tias hydrogen passivation cov tswv yim yog. siv. Lub teeb attenuation raug tshem tawm tag nrho, thiab N-hom roj teeb yog doped nrog phosphorus ntawm silicon wafer substrate, thiab tsis muaj qhov poob ntawm boron-oxygen los ua qhov chaw recombination, kom lub roj teeb yuav luag tsis muaj lub teeb attenuation.
DISSMANN Fuses raug muag thoob plaws hauv Suav teb, Tebchaws Europe, Tebchaws Meskas, Middle East thiab Southeast Asia kev lag luam. Tam sim no peb cov neeg siv khoom yog Apple, Microsoft, DELL, LG, Samsung, Siemens, Amphenol, BYD, CATL, Zotye Auto, Leadway Auto, thiab lwm yam.
Tsawg LCOE muaj peev xwm: Cov txiaj ntsig zoo ntawm kev hloov pauv kev ua haujlwm siab, tsis tshua muaj kub coefficient, qis lub teeb attenuation coefficient, thiab cov lus teb tsis tshua muaj teeb pom kev zoo yuav ua rau lub zog tsim hluav taws xob ntawm N-hom roj teeb thaum lub neej tag nrho siab dua li ntawm P-hom roj teeb. Yog tias tus nqi tsim khoom ntawm N-hom roj teeb thiab cov qauv yog tib yam li P-hom roj teeb thiab cov qauv, BOS ntsia tus nqi ntawm cov chaw nres tsheb fais fab sib txuas yuav qis dua. Ua ke nrog kev tsim hluav taws xob ntau dua, kev sib xyaw ua ke ntawm ob ua rau LCOE (tus nqi ib kilowatt-teev) ntawm N-hom roj teeb modules. Tsawg heev.
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